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Immersion Gold Surface Multilayer PCB Manufacturing 10 Layers Electronic Circuit Panel

Categories Multilayer PCB
Brand Name: JINGXIN
Model Number: JX18112725
Certification: UL, Rohs
Place of Origin: CHINA
MOQ: 1 PC
Price: Negotiation
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 30000pcs per day
Delivery Time: 5-7 days
Packaging Details: ESD Bag
Profiling Punching: V-cut, Rounting, Beveling
Surface: Immersion Gold
Number Of Layer: 10 Layers
Legend: White
Quote needs: PCB Gerber file
Product Type: RGD ROHS PCB
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    • Product Details
    • Company Profile

    Immersion Gold Surface Multilayer PCB Manufacturing 10 Layers Electronic Circuit Panel

    Immersion Gold Surface Multilayer PCB Manufacturing 10 Layers Electronic Circuit Panel


    Our Services

    Quotation time:

    1. For PCB & FPC: quotation within 1 hours if all information are clear
    2. For PCBA: quotation within 2 days if all information are clear


    Quote Requirements For PCB and PCB Assembly :


    - Gerber File and Bom List;
    - Quote Quantity;
    - Technical requirements for quoting reference;
    - Clear pictures of PCB or PCB Assembly sample if available.
    - Inspection method for PCB Assembly.

    PCBA, PCB Board assembly: SMT & PTH & BGA

    · PCBA and enclosure design

    · Components sourcing and purchasing

    · Quick prototyping

    · Plastic injection molding

    · Metal sheet stamping

    · Final assembly

    · Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

    · Custom clearance for material importing and product exporting

    led pcb board manufacturer


    Multilayer 10 layers PCB board


    The high technology as a starting point,the use of first-class equipment and raw material production and sales of high precision ,high density multi-layer LCD as our products and technology development direction,build up the company:"linePossess first-class PCB enterprise"as our vision ,to provide high quality electronic information industry PCB production Satisfactory products and sincere service" as our mission.


    Advantages


    - No MOQ

    - OEM services provided

    - Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB manufacturable

    - Factory direct price

    - Replying with price in one working day

    - Shipping within 24 hours

    - Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free


    PCB Capacity


    PCB General Capability
    Number of Layer1 - 18 Layer
    Maximum Processing Area680 × 1000MM
    Min Board Thickness2 Layer - 0.3MM ( 12 mil )
    4 Layer - 0.4MM ( 16 mil )
    6 Layer - 0.8MM ( 32 mil )
    8 Layer - 1.0MM ( 40 mil)
    10 Layer - 1.1MM ( 44 mil )
    12 Layer - 1.3MM ( 52 mil )
    14 Layer - 1.5MM ( 59 mil )
    16 Layer - 1.6MM ( 63 mil )
    18 Layer - 1.8MM ( 71 mil )
    Finished Board Thickness ToleranceThickness ≤ 1.0MM, Tolerance: ± 0.1MM
    1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
    Twisting and Bending≤ 0.75%, Min: 0.5%
    Range of TG130 - 215 ℃
    Impedance Tolerance± 10%, Min: ± 5%
    Hi-Pot TestMax: 4000V/10MA/60S
    Surface TreatmentHASL, With Lead, HASL Free Lead
    Flash Gold, Immersion Gold
    Immersion Silver, Immersion Tin
    Gold Finger, OSP
    PCB Cu Thickness + Plating
    Out Layer Cu Thickness1 - 6OZ
    Inner Layer Cu Thickness0.5 - 4OZ
    Cu Thickness of PTH20UM ≤ Average ≤ 25UM
    Min: 18UM
    HASL with LeadTin 63% Lead 37%
    HASL Free Lead7UM ≤ Surface Thickness ≤ 12UM
    Thick Gold PlatingNi Thickness: 3 - 5UM ( 120u" - 200u" )
    Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )
    Immersion GoldNi Thckness: 3 - 5UM ( 120u" - 200u" )
    Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )
    Immersion SilverAg Thickness: 0.15- 0.75 UM ( 6u" - 30u" )
    Gold FingerNi Thickness: 3 - 5UM ( 120u" - 160u" )
    Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )
    U940 PCB Pattern Limit Capability
    Min Width0.075MM ( 3 mil )
    Min Trace0.075MM ( 3 mil )
    Min Width of Ring ( Inner Layer )0.15MM ( 6 mil )
    Min Width of Ring ( Out Layer )0.1MM ( 4 mil )
    Min Solder Bridge0.1MM ( 4 mil )
    Min Height of Legend0.7MM ( 28 mil )
    Min Width of Legend0.15MM ( 6 mil )
    PCB Holes Processing Capability
    Final Hole SizeMin: Laser 0.1MM, Machine 0.2MM
    Drilling Hole Size0.10 - 6.5MM
    Drilling ToleranceNPTH: ±0.05MM, PTH: ±0.075MM
    Final Hole Size Tolerance ( PTH )φ0.20 - 1.60MM ± 0.075MM
    φ1.60 - 6.30MM ± 0.10MM
    Final Hole Size Tolerance ( NPTH )φ0.20 - 1.60MM ± 0.05MM
    φ1.60 - 6.50MM ± 0.05MM
    Drilling Strip Hole-0L ~tu.'gth /width 2:1
    Min Strip Hole Width 0.65MM
    Length & Width Tolerance ± 0.05MM
    Board Thickness / Hole Size≤ 10:1
    PCB Cover Thickness Capability
    Solder Mask ColorGreen,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
    Solder Mask ThicknessSurface Line ≥ 10UM
    Surface Line Corner ≥ 6UM
    Surface Board 10 - 25UM
    Solder Mask Bridge Width
    Legend ColorWhite,Yellow,Black
    Min Height of Legend0.70MM ( 28 mil )
    Min Width of Legend0.15MM ( 6 mil )
    Blue Gel Thickness0.2 - 1.5MM
    Blue Gel Tolerance±0.15MM
    Carbon Print Thickness5 - 25UM
    Carbon Print Min Space0.25MM
    Carbon Print Impedance200Ω
    Blind/Burried/Half Via PCB Capability
    Parameters

    (1+1)e.g.

    (4-layer)blind via:1-2,2-4

    (6-layer)buried via:2-3,3-4

    (8-layer)blind/buried:1-3,4-5,6-8

    Min ViaLaser 0.1MM, Machine 0.2MM
    Half ViaMin: 0.6MM
    Impedance Capability
    Resistance ValueSingle-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω

    PCB Photos


    Quality Immersion Gold Surface Multilayer PCB Manufacturing 10 Layers Electronic Circuit Panel for sale
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