Sign In | Join Free | My myecer.com
myecer.com
Products
Search by Category
Home > Titanium >

High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0

Categories Thermal Conductive Adhesive
Brand Name: ziitek
Model Number: TIS580-12
Certification: RoHs
Place of Origin: China
MOQ: 25PC
Supply Ability: 1000PC/Day
Delivery Time: 2-3 work days
Packaging Details: 300ml/1PC
Appearance: White paste
Density(g/cm3,25℃): 1.3
Operation temperature(℃): -60~250
Thermal Conductivity W/(m·K): 1.2
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
  • Submit Buying Request
    • Product Details
    • Company Profile

    High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0

    High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃

    TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.


    TIS580-12 Series Datasheet-(E)-REV01.pdf


    Feature


    Good thermal conductivity: 1.2W/mK
    Good maneuverability and good adhesion
    Low shrinkage
    Low viscosity, leads to void-free surface
    Good solvent resistance, water resistance
    Longer working life
    Excellent thermal shock resistance

    Application
    It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-13, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
    E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
    To potting LED Lighting heat spreader and power- driver.
    Ferrite cements
    Relay sealant
    Power transformers and coils
    Adhesion to metal glass and plastic
    tip type LED
    PCB and plastics
    small electrical devices
    IGBTS
    Transformer
    LED Power Supply
    LED Controller
    LED Lights
    LED Ceilinglamp
    Monitoring the Power Box
    AD-DC Power Adapters
    Rainproof LED Power Supply
    Waterproof LED Power Supply
    Piranha wroof and common lED module
    Typical values of TISTM580-12
    AppearanceWhite pasteTest Method
    Density(g/cm3,25℃)1.3ASTM D297
    Tack-free time(min,25℃)≤20*****
    Cure type(1-component)Dealcoholized*****
    Viscosity@25℃ Brookfield (Uncured)20K cpsASTM D1084
    Total cure time(d, 25℃)3-7*****
    Elongation(%)≥150ASTM D412
    Hardness(Shore A)25ASTM D2240
    Lap Shear Strength(MPa)≥2.0ASTM D1876
    Peel Strength(N/mm)>3.5ASTM D1876
    Operation temperature(℃)-60~250*****
    Volume Resistivity(Ω·cm)2.0×1016ASTM D257
    Dielectric Strength(KV/mm)21ASTM D149
    Dielectric Constant (1.2MHz)2.9ASTM D150
    Thermal Conductivity W/(m·K)1.2ASTM D5470
    Flame RetardancyUL94 V-0

    E331100










    Quality High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0 for sale
    Send your message to this supplier
     
    *From:
    *To: Dongguan Ziitek Electronic Materials & Technology Ltd.
    *Subject:
    *Message:
    Characters Remaining: (0/3000)
     
    Find Similar Products By Category:
    Inquiry Cart 0